Samsung to Produce 64GB 3D DDR4 DRAM Modules

Samsung is leading the way by becoming the first to mass produce 64GB DRAM modules for servers incorporating DDR4 memory and using 3D TSV package technology. These new RDIMMs will be integral in supporting large memory applications like in-memory databases and cloud-based applications that utilize large memory stores, like Oracle and SAP.

At 64GB, Samsung is producing the largest DRAM module in the market.  The dense module will improve application performance by keeping data in its memory store longer. Bits won’t have to be transferred as often between DRAM and other components such as storage. DRAM, or dynamic random-access memory, stores each bit of data in a separate capacitor within an integrated circuit. DDR4 is expected to start replacing DDR3 DRAM in servers and gaming PCs. According to Agam Shah via Computerworld, DDR4 provides up to 50 percent more memory bandwidth and 35 percent more power savings than DDR3.

Increasing DRAM density chips has been a challenge in the IT industry. However, because memory chips are becoming smaller, Samsung has taken the approach of stacking the chips vertically instead of horizontally, the industry standard. The vertical stack allows better use of the space on the DRAMs by producing twice as many bits in a package.

Intel recently debuted a DDR4 compatible server chip called Grantley. HP, Dell, Lenovo, and IBM have all announced new server product lines that will utilize the new technology.